チップ部品載置用電極
文献类型：专利
| 作者 | 東井 虎士; 沢 和弘; 松田 俊夫 |
| 发表日期 | 1996-06-14 |
| 专利号 | JP2529397B2 |
| 著作权人 | 松下電子工業株式会社 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | チップ部品載置用電極 |
| 英文摘要 | PURPOSE:To acquire submount having high adhesion strength with a chip component and high bonding strength by forming an electrode material of a mount section of a chip component and that of a bonding pad separately. CONSTITUTION:After SiO2 2 is formed on Si 1, Cr 3 is deposited and an inverse configuration of Sn 4 electrode is shaped by resist. Then, Au/Sn alloy and Au are deposited. Au, Au/Sn alloy on resist and resist are removed by using a step of resist, Sn excepting remaining Au/Sn alloy 5 and Au 6 electrode section is removed by etching to form an electrode of a chip component mount section. Ti 7 and Au 8 are deposited and removed by etching to form an electrode of a bonding pad. An electrode material of a chip component mount section and that of a bonding pad are formed separately in this way. Accordingly, it is possible to acquire submount having good adhesion strength with a chip component and high bonding strength of a wire bonding section. |
| 公开日期 | 1996-08-28 |
| 申请日期 | 1989-06-16 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34887]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 松下電子工業株式会社 |
| 推荐引用方式 GB/T 7714 | 東井 虎士,沢 和弘,松田 俊夫. チップ部品載置用電極. JP2529397B2. 1996-06-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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