光半導体モジュール
文献类型：专利
| 作者 | 黒田 文彦 |
| 发表日期 | 2000-07-21 |
| 专利号 | JP3090335B2 |
| 著作权人 | 株式会社東芝 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | 光半導体モジュール |
| 英文摘要 | PURPOSE:To attain efficient optical coupling with a smaller number of parts and a simple stage and to decrease return light by optically coupling an optical semiconductor and an optical wave guide element with the crystal face exposed to the side faces of a recessed part provided on a semiconductor substrate as a reflection surface. CONSTITUTION:A symbol 21 represents an Si substrate cut out in a direction with a {100} face as a front surface. The recessed part 25 exposing the {111} face is formed on the side faces 23, 24 to constitute the reflection surface when a groove is formed on the oxide film 22 adhering on the surface via an adequate mask resistrating stage and the groove is subjected to anisotropy etching by using a hydrazine or potassium hydroxide. Matching markers 27 are previously formed on the surface of a reflector 29 and a PD 28 with its photodetecting surface positioned downward is flip-chip-connected. The operations up to wiring simultaneously with fixing of the PD itself are completed by one stage if required electrode wirings 26 are formed on the oxide film 22 on the surface of the reflector. |
| 公开日期 | 2000-09-18 |
| 申请日期 | 1990-12-03 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34931]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 株式会社東芝 |
| 推荐引用方式 GB/T 7714 | 黒田 文彦. 光半導体モジュール. JP3090335B2. 2000-07-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。