High speed laser package
文献类型：专利
| 作者 | DIETRICH, NORMAN R.; SMELTZ, JR., PALMER D. |
| 发表日期 | 1993-06-22 |
| 专利号 | US5221860 |
| 著作权人 | AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP. OF NY |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | High speed laser package |
| 英文摘要 | An optical package for use with a laser diode in high speed applications. The package comprises a metallic housing with a multilayer ceramic (MLC) insert disposed through a sidewall thereof. The MLC insert is utilized to form a microstrip transmission line of a bandwidth sufficient to couple a high frequency signal source to the laser. A number of conductive vias are disposed through the thickness of the MLC insert at the package wall to serve as electric field shorts within the insert and improve the frequency response of the microstrip. A pair of such MLC inserts may be disposed through opposing sidewalls of the package and used to provide a conventional "butterfly" configuration, while preserving the integrity of the microstrip interconnection. |
| 公开日期 | 1993-06-22 |
| 申请日期 | 1991-02-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34938]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AMERICAN TELEPHONE AND TELEGRAPH COMPANY, A CORP. OF NY |
| 推荐引用方式 GB/T 7714 | DIETRICH, NORMAN R.,SMELTZ, JR., PALMER D.. High speed laser package. US5221860. 1993-06-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。