No wire bond plate (NWBP) packaging architecture for two dimensional stacked diode laser arrays
文献类型：专利
| 作者 | STASKUS, MICHAEL P.; HADEN, JAMES M.; ENDRIZ, JOHN G. |
| 发表日期 | 1999-07-13 |
| 专利号 | US5923692 |
| 著作权人 | JDS UNIPHASE CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | No wire bond plate (NWBP) packaging architecture for two dimensional stacked diode laser arrays |
| 英文摘要 | A high-power two-dimensional edge-emitting diode laser array comprises mounting modules, laser bars mounted on the modules, and protective caps mounted on the bars opposite the modules. The lasers are electrically connected in series through the modules and caps. The caps serve as laser bar protectors during the bar burn-in. The caps have grooves which compensate for tolerances in the thicknesses of the lasers, modules, and caps. The array is mounted on a base plate, and is in thermal communication with a heat sink. The caps and/or modules are thermal-expansion-matched to the laser bars. Eliminating the need for a wire bond plate allows shortening the modules. |
| 公开日期 | 1999-07-13 |
| 申请日期 | 1996-10-24 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35159]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | JDS UNIPHASE CORPORATION |
| 推荐引用方式 GB/T 7714 | STASKUS, MICHAEL P.,HADEN, JAMES M.,ENDRIZ, JOHN G.. No wire bond plate (NWBP) packaging architecture for two dimensional stacked diode laser arrays. US5923692. 1999-07-13. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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