Wafer level manufacturing of optical elements
文献类型：专利
| 作者 | HARDEN, BRIAN; KATHMAN, ALAN; FELDMAN, MICHAEL R. |
| 发表日期 | 2014-04-30 |
| 专利号 | EP1785746B1 |
| 著作权人 | FLIR SYSTEMS TRADING BELGIUM BVBA |
| 国家 | 欧洲专利局 |
| 文献子类 | 授权发明 |
| 其他题名 | Wafer level manufacturing of optical elements |
| 英文摘要 | Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. A seal for each die preventing the dicing slurry from getting between the wafers is desirable. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level. |
| 公开日期 | 2014-04-30 |
| 申请日期 | 1998-10-02 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35260]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FLIR SYSTEMS TRADING BELGIUM BVBA |
| 推荐引用方式 GB/T 7714 | HARDEN, BRIAN,KATHMAN, ALAN,FELDMAN, MICHAEL R.. Wafer level manufacturing of optical elements. EP1785746B1. 2014-04-30. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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