Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom
文献类型：专利
| 作者 | DAUTARTAS, MINDAUGAS F.; FREUND, JOSEPH M.; GEARY, JOHN M.; PRYZBYLEK, GEORGE J. |
| 发表日期 | 2003-04-15 |
| 专利号 | US6549550 |
| 著作权人 | LUCENT TECHNOLOGIES, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom |
| 英文摘要 | Flexible ground connectors are adapted to withstand temperature-induced stresses. The connectors may be formed of low thermal conductivity materials. The connectors may be used within a semiconductor package that also encloses a thermoelectric cooling device, a conductive submount, and a semiconductor light source. The submount may be grounded to the package wall by locating a pair of the flexible ground connectors across a gap to a ledge in the wall. The ground connectors may be formed of stainless steel, and they may be gold plated for improved electrical conductivity. |
| 公开日期 | 2003-04-15 |
| 申请日期 | 2001-02-14 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35391]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LUCENT TECHNOLOGIES, INC. |
| 推荐引用方式 GB/T 7714 | DAUTARTAS, MINDAUGAS F.,FREUND, JOSEPH M.,GEARY, JOHN M.,et al. Method for reducing thermal loss and providing mechanical compliance in a semiconductor package and the semiconductor package formed therefrom. US6549550. 2003-04-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。