Method for producing semiconductor laser components
文献类型：专利
| 作者 | ACKLIN, BRUNO; GROTSCH, STEFAN |
| 发表日期 | 2004-12-28 |
| 专利号 | US6835603 |
| 著作权人 | OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method for producing semiconductor laser components |
| 英文摘要 | A method for producing semiconductor laser components in which, a number of chip mounting areas are formed on a cooling element having an electrically insulating carrier that is in the form of a plate. A number of semiconductor laser chips are then fit to the cooling element, with one semiconductor laser chip being arranged on each chip mounting area. Finally, the cooling element, with the semiconductor bodies fit on it, is subdivided into a number of semiconductor laser components. |
| 公开日期 | 2004-12-28 |
| 申请日期 | 2001-08-20 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35435]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OSRAM OPTO SEMICONDUCTORS GMBH & CO. OHG |
| 推荐引用方式 GB/T 7714 | ACKLIN, BRUNO,GROTSCH, STEFAN. Method for producing semiconductor laser components. US6835603. 2004-12-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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