Submount integrated photodiode and laser diode package using the same
文献类型：专利
| 作者 | LEE, KYUNG HO; YOON, JEONG HO; OH, BANG WON; YANG, SI YOUNG; LEE, JONG HWA |
| 发表日期 | 2004-03-09 |
| 专利号 | US6703677 |
| 著作权人 | SAMSUNG ELECTRO-MECHANICS CO.,LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Submount integrated photodiode and laser diode package using the same |
| 英文摘要 | Disclosed is a submount integrated photodiode package with an improved metal layer configuration and laser diode package using the same. In particular, a unitary laser diode of the invention provides a light receiving area overlying a semiconductor substrate to correspond to a radiation area of light emitted from a laser diode so as to reduce chip size in respect to a conventional one while maintaining a monitoring current identical to the conventional one as well as improve heat-radiating features. The invention provides a unitary laser diode package which comprises a light receiving area overlying a semiconductor substrate and having the same configuration as a radiation area of emission light from the laser diode and a metal layer adjacent to the light receiving area. |
| 公开日期 | 2004-03-09 |
| 申请日期 | 2002-08-30 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35497]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SAMSUNG ELECTRO-MECHANICS CO.,LTD. |
| 推荐引用方式 GB/T 7714 | LEE, KYUNG HO,YOON, JEONG HO,OH, BANG WON,et al. Submount integrated photodiode and laser diode package using the same. US6703677. 2004-03-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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