Method of manufacturing semiconductor laser device, semiconductor laser device and light apparatus
文献类型：专利
| 作者 | BESSHO, YASUYUKI; OHBO, HIROKI; TAKEUCHI, KUNIO; TOKUNAGA, SEIICHI; KUNOH, YASUMITSU; HATA, MASAYUKI |
| 发表日期 | 2011-11-22 |
| 专利号 | US8064492 |
| 著作权人 | SANYO ELECTRIC CO., LTD |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method of manufacturing semiconductor laser device, semiconductor laser device and light apparatus |
| 英文摘要 | A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves. |
| 公开日期 | 2011-11-22 |
| 申请日期 | 2010-01-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35605]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SANYO ELECTRIC CO., LTD |
| 推荐引用方式 GB/T 7714 | BESSHO, YASUYUKI,OHBO, HIROKI,TAKEUCHI, KUNIO,et al. Method of manufacturing semiconductor laser device, semiconductor laser device and light apparatus. US8064492. 2011-11-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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