3D optoelectronic packaging
文献类型：专利
| 作者 | BUDD, RUSSELL A.; FORTIER, PAUL; LIBSCH, FRANK R. |
| 发表日期 | 2013-04-02 |
| 专利号 | US8411719 |
| 著作权人 | GLOBALFOUNDRIES INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | 3D optoelectronic packaging |
| 英文摘要 | An optoelectronic (OE) package or system and method for fabrication is disclosed which includes a silicon layer with a wiring layer. The silicon layer has an optical via for allowing light to pass therethrough. An optical coupling layer is bonded to the silicon layer, and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via. One or more first OE elements are coupled to the silicon layer and electrically communicating with the wiring. At least one of the first OE elements positioned in optical alignment with the optical via for receiving the light. A second OE element embedded within the wiring layer. A carrier may be interposed between electrical interconnect elements and positioned between the wiring layer and a circuit board. |
| 公开日期 | 2013-04-02 |
| 申请日期 | 2012-01-26 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35623]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GLOBALFOUNDRIES INC. |
| 推荐引用方式 GB/T 7714 | BUDD, RUSSELL A.,FORTIER, PAUL,LIBSCH, FRANK R.. 3D optoelectronic packaging. US8411719. 2013-04-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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