Optical device package
文献类型：专利
| 作者 | NISHIZAWA HIDEAKI |
| 发表日期 | 1990-04-03 |
| 专利号 | CA1267468C |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 国家 | 加拿大 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical device package |
| 英文摘要 | OPTICAL DEVICE PACKAGE Abstract of the Disclosure: In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central Portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bond- ing pad by said solder layer, the optical device chip is die-bonded in a stable state. |
| 公开日期 | 1990-04-03 |
| 申请日期 | 1984-11-06 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35806]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 推荐引用方式 GB/T 7714 | NISHIZAWA HIDEAKI. Optical device package. CA1267468C. 1990-04-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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