Photo-semiconductor module
文献类型：专利
| 作者 | MASUKO TAKAYUKI; OKAMOTO AKIRA; MORIYA KAORU; OKAMURA KOJI; ARIMA TADAO |
| 发表日期 | 1993-06-01 |
| 专利号 | CA2019074C |
| 著作权人 | FUJITSU LIMITED |
| 国家 | 加拿大 |
| 文献子类 | 授权发明 |
| 其他题名 | Photo-semiconductor module |
| 英文摘要 | Abstract of the Disclosure A photo-semiconductor module is disclosed wherein a reliable airtight condition can be obtained and an operability in assembly can be improved. The photo-semiconductor module comprises a substrate carried in a casing, a photo-semiconductor chip mounted on the substrate, and a support member carried on the substrate and having an inclined face which is inclined by an angle of 45 degrees with respect to a surface of the substrate. A semi-spherical lens is securely mounted on the inclined face of the support member, and an opening formed in a side wall of the casing is sealed airtight by a glass member while an upper portion of the casing is sealed airtight by a lid. When an optical fiber is mounted onto the casing such that an end face thereof may be located in the opening in the side wall of the casing, the optical fiber and the photo-semiconductor chip are optically coupled to each other by way of the semi-spherical lens. |
| 公开日期 | 1990-12-19 |
| 申请日期 | 1990-06-15 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/35986]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LIMITED |
| 推荐引用方式 GB/T 7714 | MASUKO TAKAYUKI,OKAMOTO AKIRA,MORIYA KAORU,et al. Photo-semiconductor module. CA2019074C. 1993-06-01. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。