Low-stress coupling of electrooptical device to optical fiber
文献类型：专利
| 作者 | LADANY, IVAN |
| 发表日期 | 1991-09-17 |
| 专利号 | US5048919 |
| 著作权人 | TTI INVENTIONS A LLC |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Low-stress coupling of electrooptical device to optical fiber |
| 英文摘要 | Means for coupling an electrooptical device, such as a semiconductor laser, to an optical fiber avoids heat-induced stresses that commonly result from joining methods employing welding, soldering, or catalytic adhesive compositions. In this invention, the electrooptical device and fiber are firmly mounted within separate elements, such as copper tubes, by means of potting compound or the like, and after close end-to-end supported alignment of the device and fiber elements to obtain optimum light coupling, the assemblage is immersed in an electrolytic plating solution. Plating current is then applied and maintained until a sufficiently strong layer of plating metal encompasses the tubular elements and thereby rigidly fixes the alignment of the device and fiber end at its optimum position. Since the plating operation proceeds in a substantially isothermic environment, there is no misaligning stress introduced which would otherwise degrade the coupling efficiency. |
| 公开日期 | 1991-09-17 |
| 申请日期 | 1990-10-05 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36004]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TTI INVENTIONS A LLC |
| 推荐引用方式 GB/T 7714 | LADANY, IVAN. Low-stress coupling of electrooptical device to optical fiber. US5048919. 1991-09-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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