Process for bonding semiconductor chips to substrates
文献类型：专利
| 作者 | KARL, ALOIS; OSOJNIK, KARL; SPAETH, WERNER; WAITL, GUENTHER |
| 发表日期 | 1991-07-02 |
| 专利号 | US5027995 |
| 著作权人 | SIEMENS AKTIENGESELLSCHAFT |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Process for bonding semiconductor chips to substrates |
| 英文摘要 | A semiconductor chip (1) is bonded to a substrate (2) serving as a component housing, a contact part, an insulative part or a connecting part without the use of a high-temperature process or any additional bonding medium such as solder or flux. The backside of the semiconductor chip (1) or substrate (2) is structured to include specially formed bumps (3) for the necessary connections. A ductile metal is used for these bumps (3). The bond to the substrate (2) is formed by using pressure and/or ultrasonic energy. The process according to this invention is particularly suitable for bonding components in data link receivers, optoelectronic couplers, transmitters (LEDs, IREDs) and ISDN modules. |
| 公开日期 | 1991-07-02 |
| 申请日期 | 1991-02-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36025]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SIEMENS AKTIENGESELLSCHAFT |
| 推荐引用方式 GB/T 7714 | KARL, ALOIS,OSOJNIK, KARL,SPAETH, WERNER,et al. Process for bonding semiconductor chips to substrates. US5027995. 1991-07-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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