Method of forming bonding bumps by punching a metal ribbon
文献类型：专利
| 作者 | ITOH, MASATAKA; HONMOU, HIROSHI |
| 发表日期 | 1994-01-04 |
| 专利号 | US5275970 |
| 著作权人 | NEC CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method of forming bonding bumps by punching a metal ribbon |
| 英文摘要 | Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount. |
| 公开日期 | 1994-01-04 |
| 申请日期 | 1991-10-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36059]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORPORATION |
| 推荐引用方式 GB/T 7714 | ITOH, MASATAKA,HONMOU, HIROSHI. Method of forming bonding bumps by punching a metal ribbon. US5275970. 1994-01-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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