Structure of semiconductor laser package
文献类型：专利
| 作者 | IWAMOTO, KOJI |
| 发表日期 | 1993-08-03 |
| 专利号 | US5233622 |
| 著作权人 | SONY CORPORATION A CORPORATION OF JAPAN |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Structure of semiconductor laser package |
| 英文摘要 | A semiconductor laser package comprises a cooling structure constituted by sequentially laminating a lower substrate, a Peltier element, and an upper substrate, a heat sink having a laser element and mounted on the cooling structure, and a cap member for sealing the cooling structure and the heat sink, wherein one of the upper and lower substrate also serves as a base member of the semiconductor laser package. |
| 公开日期 | 1993-08-03 |
| 申请日期 | 1992-02-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36082]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SONY CORPORATION A CORPORATION OF JAPAN |
| 推荐引用方式 GB/T 7714 | IWAMOTO, KOJI. Structure of semiconductor laser package. US5233622. 1993-08-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。