Heat radiating component and semiconductor device provided with the same
文献类型：专利
| 作者 | NAKAMURA, TSUTOMU; IGUCHI, TAKAHISA; NAKAI, TETSUO |
| 发表日期 | 1994-03-29 |
| 专利号 | US5299214 |
| 著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Heat radiating component and semiconductor device provided with the same |
| 英文摘要 | A semiconductor laser is provided with a heat radiating component for radiating or dissipating heat which is generated in operation. In this heat radiating component, a polycrystalline diamond layer (3) synthesized by vapor deposition is formed on an upper surface of a stem (4). A semiconductor laser element (1) is bonded, e.g. by brazing to the surface of the vapor-deposited polycrystalline diamond layer (3) through a brazing filler metal (2). The heat radiating component has a thermal expansion coefficient which is the same as that of an LSI chip to be mounted thereon to provide an excellent heat radiating property. |
| 公开日期 | 1994-03-29 |
| 申请日期 | 1992-06-26 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36095]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 推荐引用方式 GB/T 7714 | NAKAMURA, TSUTOMU,IGUCHI, TAKAHISA,NAKAI, TETSUO. Heat radiating component and semiconductor device provided with the same. US5299214. 1994-03-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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