Package-type semiconductor laser device
文献类型：专利
| 作者 | TANAKA, HARUO; AOKI, NAOFUMI |
| 发表日期 | 1994-07-05 |
| 专利号 | US5327443 |
| 著作权人 | ROHM CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Package-type semiconductor laser device |
| 英文摘要 | A package-type semiconductor laser device comprises a metallic heat sink plate, a semiconductor laser chip carried by the heat sink plate, and a cap mounted on the heat sink plate to enclose the laser chip. The cap has a transparent window in opposed relation to the heat sink plate. The laser chip has a front facet oriented so that the laser chip emits an output laser beam generally in parallel to the heat sink plate. The laser device further comprises a reflective member arranged in the cap for deflecting the output laser beam toward the window of the cap. |
| 公开日期 | 1994-07-05 |
| 申请日期 | 1992-10-27 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36118]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM CO., LTD. |
| 推荐引用方式 GB/T 7714 | TANAKA, HARUO,AOKI, NAOFUMI. Package-type semiconductor laser device. US5327443. 1994-07-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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