Semiconductor laser and manufacturing method therefor
文献类型：专利
| 作者 | TANAKA, HARUO; MUSHIAGE, MASATO; KUSUNOKI, KAORU |
| 发表日期 | 1995-02-21 |
| 专利号 | US5392304 |
| 著作权人 | ROHM CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor laser and manufacturing method therefor |
| 英文摘要 | A semiconductor laser adaptable for a 3-beam method, including a semiconductor laser chip bonded on a primary plane of a flat submount, the semiconductor laser chip having a thickness of 30 to 80 mu m is provided. Also provided is a method for manufacturing a semiconductor laser including the steps of: sequentially stacking layers of compound semiconductor materials on a semiconductor substrate to form a semiconductor laser wafer; mechanically abrading the semiconductor substrate to make it thin; subjecting the mechanically abraded face of the semiconductor substrate to a chemical treatment; forming an electrode film on both sides of the semiconductor laser wafer thus treated; and cutting the semiconductor laser wafer into chips and bonding each of the chips on a submount. |
| 公开日期 | 1995-02-21 |
| 申请日期 | 1993-06-01 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36144]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ROHM CO., LTD. |
| 推荐引用方式 GB/T 7714 | TANAKA, HARUO,MUSHIAGE, MASATO,KUSUNOKI, KAORU. Semiconductor laser and manufacturing method therefor. US5392304. 1995-02-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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