Micropost waste heat removal system
文献类型：专利
| 作者 | MUNDINGER, DAVID C.; SCIFRES, DONALD R. |
| 发表日期 | 1996-05-28 |
| 专利号 | US5520244 |
| 著作权人 | SDL, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Micropost waste heat removal system |
| 英文摘要 | A cooling device formed in a thermally conductive substrate having a microstructure, such as a plurality of thermally conductive posts spaced apart by dimensions that induce capillary action in a liquid coolant. The posts extend away from the heated region and a space between the posts is supplied with liquid coolant which is contained by a meniscus near the tips of the posts. The coolant vaporizes at the meniscus and absorbs heat but, due to increased pressure in the coolant contained by the meniscus, does not boil within the space between the posts, allowing more liquid coolant contact with the thermally conductive substrate and posts. The vaporized coolant may be discharged into the air or into a chamber adjoining the tips having a lower pressure for removal of additional heat by gaseous expansion. The discharge of gaseous coolant allows the capillary flow of the liquid coolant in the space to be unimpeded, and the flow of liquid coolant may be augmented by a fluid pump. The gaseous coolant may be in thermal contact with a condenser that liquefies the coolant for supply to the space, by an array of capillaries, in a self contained cooling device. An array of such devices is provided with holes and stacked to connect adjacent liquid and gaseous coolant flows to cool an array of heated objects, such as laser diode bars. |
| 公开日期 | 1996-05-28 |
| 申请日期 | 1994-06-13 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36194]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SDL, INC. |
| 推荐引用方式 GB/T 7714 | MUNDINGER, DAVID C.,SCIFRES, DONALD R.. Micropost waste heat removal system. US5520244. 1996-05-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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