Electrostatic bonding of optical fibers to substrates
文献类型：专利
| 作者 | HAN, HONGTAO; TAN, SONGSHENG |
| 发表日期 | 1996-07-02 |
| 专利号 | US5533158 |
| 著作权人 | WHITAKER CORPORATION, THE |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Electrostatic bonding of optical fibers to substrates |
| 英文摘要 | An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180 DEG -500 DEG C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential. |
| 公开日期 | 1996-07-02 |
| 申请日期 | 1994-09-12 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36210]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | WHITAKER CORPORATION, THE |
| 推荐引用方式 GB/T 7714 | HAN, HONGTAO,TAN, SONGSHENG. Electrostatic bonding of optical fibers to substrates. US5533158. 1996-07-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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