Plastic-encapsulated semiconductor device
文献类型：专利
| 作者 | OHTA, HIDEO; OKUYAMA, TETSUO; FUJIEDA, SHINETSU; KAJIURA, SADAO; YOSHIZUMI, AKIRA |
| 发表日期 | 1997-06-24 |
| 专利号 | US5641997 |
| 著作权人 | KABUSHIKI KAISHA TOSHIVA |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Plastic-encapsulated semiconductor device |
| 英文摘要 | A semiconductor chip is positioned between encapsulating sheets. The encapsulating sheets each have a surface that is highly adhesive and a surface that is less adhesive. The surface of the encapsulating sheet that is highly adhesive contacts the chip. The surface that is less adhesive contacts a mold. Subsequently, encapsulation is carried out by molding. A soldering resistance can be improved without reducing a mold releasing property. |
| 公开日期 | 1997-06-24 |
| 申请日期 | 1994-09-13 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36211]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIVA |
| 推荐引用方式 GB/T 7714 | OHTA, HIDEO,OKUYAMA, TETSUO,FUJIEDA, SHINETSU,et al. Plastic-encapsulated semiconductor device. US5641997. 1997-06-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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