Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer
文献类型：专利
| 作者 | FURUYAMA, HIDETO; HAMASAKI, HIROSHI; KOBAYASHI, TAMON |
| 发表日期 | 1996-09-24 |
| 专利号 | US5559918 |
| 著作权人 | KABUSHIKI KAISHA TOSHIBA |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer |
| 英文摘要 | An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device. |
| 公开日期 | 1996-09-24 |
| 申请日期 | 1995-01-27 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36233]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KABUSHIKI KAISHA TOSHIBA |
| 推荐引用方式 GB/T 7714 | FURUYAMA, HIDETO,HAMASAKI, HIROSHI,KOBAYASHI, TAMON. Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer. US5559918. 1996-09-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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