Passive alignment of optoelectronic components to optical waveguides using flip-chip bonding technology
文献类型：专利
| 作者 | HAHN, KENNETH H.; KANESHIRO, RONALD T. |
| 发表日期 | 2003-02-05 |
| 专利号 | EP1120673B1 |
| 著作权人 | AGILENT TECHNOLOGIES, INC. (A DELAWARE CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 授权发明 |
| 其他题名 | Passive alignment of optoelectronic components to optical waveguides using flip-chip bonding technology |
| 英文摘要 | In an apparatus for alignment of an optical waveguide with a photonic device (405) the optical waveguide for transmission of light therethrough has an extremity (403) at which a beam of light (S) is input into or output from the optical waveguide. The photonic device (405) has a central region (407) at which a beam of light is input in or output from the photonic device (405) on a surface of the photonic device. Further a first and a second pair of wetable pads is provided, the first pair including a first wetable pad directly attached to the phontonic device and a second wetable pad directly attached to a substrate (415). The second pair of wetable pads (409, 411) includes a third wetable pad (409) directly attached to the waveguide at a first lateral distance (D1) from the extremity of the waveguide, and a fourth wetable pad (411) directly attached to the substrate (415) at a second lateral distance (D2) from the central portion of the photonic device substantially equal to the first lateral distance. A first bond causes a self-alignment of the first pad and the second pad, and a second bond (413) causes a self-alignment of the third pad and the fourth pad, the second bond together with the first bond providing a desired optical alignment of the extremity of the optical waveguide with the central portion of the photonic device. The first bond and the second bond have a height in the range of 70µm to 80µm, and said wetable pads have a width dimension of approximately 100µm. |
| 公开日期 | 2003-02-05 |
| 申请日期 | 1995-07-11 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36270]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AGILENT TECHNOLOGIES, INC. (A DELAWARE CORPORATION |
| 推荐引用方式 GB/T 7714 | HAHN, KENNETH H.,KANESHIRO, RONALD T.. Passive alignment of optoelectronic components to optical waveguides using flip-chip bonding technology. EP1120673B1. 2003-02-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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