Selfaligned optical element and optical wave-guide by means of solder bumps on rectangular pads
文献类型：专利
| 作者 | SASAKI, JUN-ICHI, C/O NEC CORPORATION; ITOH, MASATAKA, C/O NEC CORPORATION; HONMOU, HIROSHI, C/O NEC CORPORATION; TORIKAI, TOSHIKATA, C/O NEC CORPORATION |
| 发表日期 | 2005-10-19 |
| 专利号 | EP0718653B1 |
| 著作权人 | NEC CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 授权发明 |
| 其他题名 | Selfaligned optical element and optical wave-guide by means of solder bumps on rectangular pads |
| 英文摘要 | An optical module has an optical wave-guide structure (12) formed on a silicon substrate (11) and a laser diode array (13) solder bonded to first pads (11a-11j) patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads (11a-11j) are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension. |
| 公开日期 | 2005-10-19 |
| 申请日期 | 1995-12-22 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36299]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NEC CORPORATION |
| 推荐引用方式 GB/T 7714 | SASAKI, JUN-ICHI, C/O NEC CORPORATION,ITOH, MASATAKA, C/O NEC CORPORATION,HONMOU, HIROSHI, C/O NEC CORPORATION,et al. Selfaligned optical element and optical wave-guide by means of solder bumps on rectangular pads. EP0718653B1. 2005-10-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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