Laser diode component with heat sink and method of producing a plurality of laser diode components
文献类型：专利
| 作者 | SPAETH, WERNER |
| 发表日期 | 1998-09-22 |
| 专利号 | US5812570 |
| 著作权人 | LANTIQ BETEILIGUNGS-GMBH & CO. KG |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Laser diode component with heat sink and method of producing a plurality of laser diode components |
| 英文摘要 | A laser diode component includes a semiconductor body secured on a heat sink which includes a dissipator and an electrically and thermally conductive connection plate. The semiconductor body is secured to the connection plate, which in turn is applied to the dissipator. The connection plate is formed of a material having a coefficient of thermal expansion that is similar to the coefficient of thermal expansion of the semiconductor material of the semiconductor body. A connecting layer between the semiconductor body and the connection plate is preferably formed of hard solder. The dissipator is secured to the connection plate, for example through the use of a thermally conductive adhesive. A method for producing a plurality of laser diode components includes making many such laser diode components as a unit, and then subsequently cutting them apart. |
| 公开日期 | 1998-09-22 |
| 申请日期 | 1996-09-30 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36356]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LANTIQ BETEILIGUNGS-GMBH & CO. KG |
| 推荐引用方式 GB/T 7714 | SPAETH, WERNER. Laser diode component with heat sink and method of producing a plurality of laser diode components. US5812570. 1998-09-22. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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