Expansion-matched high-thermal-conductivity stress-relieved mounting modules
文献类型：专利
| 作者 | HADEN, JAMES M.; STASKUS, MICHAEL P. |
| 发表日期 | 1998-12-08 |
| 专利号 | US5848083 |
| 著作权人 | JDS UNIPHASE CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Expansion-matched high-thermal-conductivity stress-relieved mounting modules |
| 英文摘要 | A mounting module (submount) for a high-power heat-dissipating element comprises a mounting plate thermal-expansion-matched to the element, a high-thermal-conductivity bulk layer having stress-relief apertures, and an auxiliary plate bonded to the bulk layer opposite the mounting plate. The element is mounted on the mounting plate, while the bulk layer is attached to the mounting plate on the side opposite the element. The apertures accommodate the expansion of the bulk layer along a major dimension of the mounting plate. The apertures run transverse to the mounting plate, so as not to impede heat flow through the mounting plate. The apertures serve either as reservoirs for excess solder during module assembly, or as conduits for cooling fluid. The bulk layer comprises either stacked sheets having aperture sections defined prior to assembly, or blocks defining the apertures at the block interfaces. Suitable heat-dissipating elements include high-power, high-duty cycle diode lasers and laser arrays, FETs, MOPAs, thyristors, and other high-power electronic components. For a GaAs laser bar, the mounting plate can be a thin CuW or Cu/Mo plate, while the bulk layer may be made of Cu. The stress-relief allows brazing the bulk layer and the mounting plate. |
| 公开日期 | 1998-12-08 |
| 申请日期 | 1996-10-24 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36359]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | JDS UNIPHASE CORPORATION |
| 推荐引用方式 GB/T 7714 | HADEN, JAMES M.,STASKUS, MICHAEL P.. Expansion-matched high-thermal-conductivity stress-relieved mounting modules. US5848083. 1998-12-08. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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