中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
High-thermal-conductivity sealed package for fiber optic coupling to an optoelectronic device

文献类型:专利

作者ROSSI, DAVID M.; RANSOM, HARRISON L.
发表日期1999-02-16
专利号US5872881
著作权人JDS UNIPHASE CORPORATION
国家美国
文献子类授权发明
其他题名High-thermal-conductivity sealed package for fiber optic coupling to an optoelectronic device
英文摘要A hermetically sealed package for an optoelectronic device such as a diode laser comprises a side wall welded to a thermally conductive heat sink mount, and a lid welded to the side wall. Testing and alignment of the device are performed before the attachment of the side wall to the mount. Feedthroughs for optical fibers and electrical connections run through the side wall. The feedthrough seals are established within projections extending away from the side wall, to protect the seals from melting during welding steps. A high-resistivity piece is present at the interface between the side walls and the base, to provide heating localized to the interface, and thereby reduce the heating of the laser during welding. The mount is pressed into a receiving structure, which is attached to an external heat sink. The bottom surface of the mount protrudes from the receiving structure, and is in direct contact with the external heat sink. In an alternative embodiment, the optoelectronic device and optical fiber are encapsulated in epoxy after optical and electrical testing and alignment.
公开日期1999-02-16
申请日期1997-02-12
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/36380]  
专题半导体激光器专利数据库
作者单位JDS UNIPHASE CORPORATION
推荐引用方式
GB/T 7714
ROSSI, DAVID M.,RANSOM, HARRISON L.. High-thermal-conductivity sealed package for fiber optic coupling to an optoelectronic device. US5872881. 1999-02-16.

入库方式: OAI收割

来源:西安光学精密机械研究所

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