中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks

文献类型:专利

作者SHIOMI, HIROMU; NAKAHATA, HIDEAKI; NISHIBAYASHI, YOSHIKI; SHIKATA, SHIN-ICHI
发表日期1999-02-23
专利号US5874775
著作权人SUMITOMO ELECTRIC INDUSTRIES, LTD.
国家美国
文献子类授权发明
其他题名Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks
英文摘要A diamond heat sink of the present invention comprises: a support layer consisting of substantially undoped diamond; a heat sensitive layer consisting of doped diamond, disposed on the surface of the support layer; an insulation layer consisting of substantially undoped diamond, disposed on a predetermined region in the surface of the heat sensitive layer; electrodes disposed on the heat sensitive layer, wherein an exothermal device is placed on the surface of the insulation layer; and a cooling structure disposed on the backside of the support layer, the cooling structure having at least one microchannel, the microchannel being defined by a diamond, wherein an exothermal device is to be placed on the surface of the insulation layer; and wherein the heat sensitive layer and the electrodes form a thermistor, the electrical resistivity of the thermistor being capable of varying corresponding to heat generated from the exothermal device and transferred through the insulation layer to the thermistor.
公开日期1999-02-23
申请日期1997-04-14
状态失效
源URL[http://ir.opt.ac.cn/handle/181661/36396]  
专题半导体激光器专利数据库
作者单位SUMITOMO ELECTRIC INDUSTRIES, LTD.
推荐引用方式
GB/T 7714
SHIOMI, HIROMU,NAKAHATA, HIDEAKI,NISHIBAYASHI, YOSHIKI,et al. Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks. US5874775. 1999-02-23.

入库方式: OAI收割

来源:西安光学精密机械研究所

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