Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks
文献类型:专利
作者 | SHIOMI, HIROMU; NAKAHATA, HIDEAKI; NISHIBAYASHI, YOSHIKI; SHIKATA, SHIN-ICHI |
发表日期 | 1999-02-23 |
专利号 | US5874775 |
著作权人 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks |
英文摘要 | A diamond heat sink of the present invention comprises: a support layer consisting of substantially undoped diamond; a heat sensitive layer consisting of doped diamond, disposed on the surface of the support layer; an insulation layer consisting of substantially undoped diamond, disposed on a predetermined region in the surface of the heat sensitive layer; electrodes disposed on the heat sensitive layer, wherein an exothermal device is placed on the surface of the insulation layer; and a cooling structure disposed on the backside of the support layer, the cooling structure having at least one microchannel, the microchannel being defined by a diamond, wherein an exothermal device is to be placed on the surface of the insulation layer; and wherein the heat sensitive layer and the electrodes form a thermistor, the electrical resistivity of the thermistor being capable of varying corresponding to heat generated from the exothermal device and transferred through the insulation layer to the thermistor. |
公开日期 | 1999-02-23 |
申请日期 | 1997-04-14 |
状态 | 失效 |
源URL | [http://ir.opt.ac.cn/handle/181661/36396] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
推荐引用方式 GB/T 7714 | SHIOMI, HIROMU,NAKAHATA, HIDEAKI,NISHIBAYASHI, YOSHIKI,et al. Diamond heat sink including microchannel therein and methods for manufacturing diamond heat sinks. US5874775. 1999-02-23. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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