Semiconductor laser array stack package & method of fabrication
文献类型：专利
| 作者 | WILSON, STEWART WAYNE; PATEL, RUSHIKESH M. |
| 发表日期 | 2001-02-27 |
| 专利号 | US6195376 |
| 著作权人 | OPTO POWER CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor laser array stack package & method of fabrication |
| 英文摘要 | Semiconductor laser diodes or diode bars are assembled into stacks by a method which permits testing of an entire stack at once and which uses only high temperature solder. The stack includes a plurality of submounts which resemble elongated bars which are square in cross section. Laser diodes (or diode bars) are sandwiched between adjacent submounts. Each submount has an elongated mesa and the mesas are so shaped and positioned in the stack to form a set of ridges which fit into a set of grooves in a substrate. The diodes are bonded to adjacent submounts in a stack simultaneously by reflowing solder preforms (high temperature) in a reflow oven. The stack is secured in place in the grooves of the substrate by reflowing solder placed at the bottom of the grooves. |
| 公开日期 | 2001-02-27 |
| 申请日期 | 1998-11-10 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36540]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OPTO POWER CORPORATION |
| 推荐引用方式 GB/T 7714 | WILSON, STEWART WAYNE,PATEL, RUSHIKESH M.. Semiconductor laser array stack package & method of fabrication. US6195376. 2001-02-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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