Heat-dissipating package for microcircuit devices and process for manufacture
文献类型：专利
| 作者 | POLESE, FRANK J.; OCHERETYANSKY, VLADIMIR |
| 发表日期 | 1999-10-26 |
| 专利号 | US5972737 |
| 著作权人 | POLESE, FRANK J. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Heat-dissipating package for microcircuit devices and process for manufacture |
| 英文摘要 | High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of an inexpensive high thermal conductivity material having a high coefficient of thermal expansion (CTE) such as copper and at least one other low CTE material such as tungsten, the proportions of which are adjusted to match the CTE of the microcircuit material. The pressed compacts are sintered in order to achieve an homogeneous distribution of the melting copper throughout the structure. A multilevel embodiment of the heatsink comprises two bonded layers of metals or composites having their coefficients of thermal expansion adjusted to match those of the semiconductor material and of any supporting structures respectively, wherein the second layer in contact with the supporting structure has a high CTE and the other has a lower CTE. Another embodiment provides for bonding a composite heatsink to a high thermal conductivity pedestal which mounts the microcircuit device, using sintering to shrink an aperture engaged by the pedestal. |
| 公开日期 | 1999-10-26 |
| 申请日期 | 1999-01-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36549]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | POLESE, FRANK J. |
| 推荐引用方式 GB/T 7714 | POLESE, FRANK J.,OCHERETYANSKY, VLADIMIR. Heat-dissipating package for microcircuit devices and process for manufacture. US5972737. 1999-10-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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