Dual-enclosure optoelectronic packages
文献类型：专利
| 作者 | VERDIELL, JEAN-MARC |
| 发表日期 | 2001-06-26 |
| 专利号 | US6252726 |
| 著作权人 | INTEL CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Dual-enclosure optoelectronic packages |
| 英文摘要 | A package for housing optical components where the enclosure has two enclosures. The first enclosure for the optical components (the optical enclosure) provides necessary alignment and hermeticity as well as a heat pipe to dissipate heat generated by the optical component. The second enclosure for the electronic components (the electronic enclosure) provides proper hermeticity and heat dissipation devices (e.g., a Peltier cooling device). The first enclosure can sit atop the second enclosure or vice versa. In an embodiment, a heat sink can be attached to the top of the dual-enclosure assembly. |
| 公开日期 | 2001-06-26 |
| 申请日期 | 1999-09-02 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36598]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | VERDIELL, JEAN-MARC. Dual-enclosure optoelectronic packages. US6252726. 2001-06-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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