Pressure-bonded heat-sink system
文献类型：专利
| 作者 | BEWLEY, WILLIAM W.; AIFER, EDWARD A.; FELIX, CHRISTOPHER L.; VURGAFTMAN, IGOR; MEYER, JERRY R.; GLESENER, JOHN |
| 发表日期 | 2002-09-10 |
| 专利号 | US6448642 |
| 著作权人 | NAVY, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Pressure-bonded heat-sink system |
| 英文摘要 | This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm2. The method is characterized by the steps of removing heat from a heat source device comprising the steps of placing a heat source device in contact with a heat source and applying a sufficient force to form a pressure bond between the heat source device and the heat sink wherein thermal resistance at the interface between the heat source device and the heat sink after the thermal bond is established is less than about 5 K/kW-cm2. The heat sink system includes a heat source device and a heat sink in contact with the heat source device with thermal resistance at the interface of the heat source device and said heat sink is less than about 5 K/kW-cm2. |
| 公开日期 | 2002-09-10 |
| 申请日期 | 2000-01-27 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36622]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | NAVY, THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE |
| 推荐引用方式 GB/T 7714 | BEWLEY, WILLIAM W.,AIFER, EDWARD A.,FELIX, CHRISTOPHER L.,et al. Pressure-bonded heat-sink system. US6448642. 2002-09-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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