Concentrically leaded power semiconductor device package
文献类型：专利
| 作者 | LOH, BAN POH; WOOLVERTON, DOUGLAS P.; SNYDER, WAYNE L. |
| 发表日期 | 2002-12-10 |
| 专利号 | US6492725 |
| 著作权人 | LUMILEDS LLC |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Concentrically leaded power semiconductor device package |
| 英文摘要 | A concentrically leaded power semiconductor package includes two or more generally concentric conductors. An inner conductor may provide an attachment point for one or more semiconductor devices at an end of the inner conductor and an electrical connection at an opposite end. An outer conductor may be pressed onto the inner conductor and may be separated by an electrical insulator. A semiconductor device, such as a light emitting diode (LED), may be attached to the inner conductor by epoxy gluing or by soldering, and may be attached to the outer conductor by a bonding wire. The package may be cylindrical or a rectangular solid. The package may incorporate additional semiconductor mounting surfaces and more than two conductors. |
| 公开日期 | 2002-12-10 |
| 申请日期 | 2000-02-04 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36624]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | LUMILEDS LLC |
| 推荐引用方式 GB/T 7714 | LOH, BAN POH,WOOLVERTON, DOUGLAS P.,SNYDER, WAYNE L.. Concentrically leaded power semiconductor device package. US6492725. 2002-12-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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