Led lead frame assembly
文献类型：专利
| 作者 | WOJNAROWSKI, ROBERT J.; URIARTE, RICHARD J.; HORKAY, FERENC; BENICEWICZ, PAMELA K.; MINNEAR, WILLIAM P. |
| 发表日期 | 2002-06-18 |
| 专利号 | US6407411 |
| 著作权人 | GENERAL ELECTRIC COMPANY |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Led lead frame assembly |
| 英文摘要 | An improved LED lead frame packaging assembly includes a thermally conducting, electrically insulating material that enhances the thermal conduction and structural integrity of the assembly, a UV-resistant encapsulantmaterial, and an integral ESD material that reduces electrostatic discharge. The thermally conducting, electrically insulating material creates an electrically insulating, thermally conductive path in the lead frame assembly for dissipation of power and also acts as a mounting structure thus allowing for the use of a soft encapsulant material, preferably a silicone. |
| 公开日期 | 2002-06-18 |
| 申请日期 | 2000-04-13 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36649]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GENERAL ELECTRIC COMPANY |
| 推荐引用方式 GB/T 7714 | WOJNAROWSKI, ROBERT J.,URIARTE, RICHARD J.,HORKAY, FERENC,et al. Led lead frame assembly. US6407411. 2002-06-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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