Semiconductor device package for optical communication device
文献类型：专利
| 作者 | IIDA, MASANORI; ASAKURA, HIROYUKI |
| 发表日期 | 2002-10-15 |
| 专利号 | US6465858 |
| 著作权人 | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor device package for optical communication device |
| 英文摘要 | A semiconductor device package having a heat radiating base that has a depression. A circuit substrate is disposed on the heat radiating base to cover at least the depression. At least two semiconductor devices are mounted on both sides of the circuit substrates. The semiconductor device mounted on one major surface of the circuit substrate is coupled to the heat radiating base and is disposed in the depression. |
| 公开日期 | 2002-10-15 |
| 申请日期 | 2001-03-20 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36736]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
| 推荐引用方式 GB/T 7714 | IIDA, MASANORI,ASAKURA, HIROYUKI. Semiconductor device package for optical communication device. US6465858. 2002-10-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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