Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier
文献类型：专利
| 作者 | TUNG, I-CHUNG; YU, JIUN-SHIAN; CHEN, KUO-BIN; HSU, SHIH-PING |
| 发表日期 | 2002-11-05 |
| 专利号 | US6475327 |
| 著作权人 | PHOENIX PRECISION TECHNOLOGY CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier |
| 英文摘要 | A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip. |
| 公开日期 | 2002-11-05 |
| 申请日期 | 2001-04-05 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36741]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | PHOENIX PRECISION TECHNOLOGY CORPORATION |
| 推荐引用方式 GB/T 7714 | TUNG, I-CHUNG,YU, JIUN-SHIAN,CHEN, KUO-BIN,et al. Attachment of a stiff heat spreader for fabricating a cavity down plastic chip carrier. US6475327. 2002-11-05. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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