Optical semiconductor device package and optical semiconductor module having the same
文献类型：专利
| 作者 | OKADA, TAKAHIRO; KIMURA, TOSHIO |
| 发表日期 | 2002-12-03 |
| 专利号 | US6489677 |
| 著作权人 | FURUKAWA ELECTRIC CO., LTD., THE |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical semiconductor device package and optical semiconductor module having the same |
| 英文摘要 | An optical semiconductor device module includes an optical semiconductor device package, an optical semiconductor device such as a laser diode accommodated in the package, and a cooling area on an inner face of a metal bottom plate of the package and operable to cool the optical semiconductor device. A groove permitting molten solder to flow therein is formed in at least part of the solder joint area on the inner face of the metal bottom plate. |
| 公开日期 | 2002-12-03 |
| 申请日期 | 2001-05-03 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36747]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FURUKAWA ELECTRIC CO., LTD., THE |
| 推荐引用方式 GB/T 7714 | OKADA, TAKAHIRO,KIMURA, TOSHIO. Optical semiconductor device package and optical semiconductor module having the same. US6489677. 2002-12-03. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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