Photoelectronic device and method of manufacturing the same
文献类型：专利
| 作者 | TAKAHASHI, SHOICHI; NAKA, HIROSHI; MIURA, TOSHIMASA; EGUCHI, SHUJI |
| 发表日期 | 2002-04-16 |
| 专利号 | US6371664 |
| 著作权人 | OPNEXT JAPAN, INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Photoelectronic device and method of manufacturing the same |
| 英文摘要 | There is provided a method for manufacturing a photoelectronic device comprising a silicon platform (support substrate) having a groove for guiding an optical fiber, a semiconductor laser chip secured on the substrate and an optical fiber fitted in the groove at one end thereof to be secured on the support substrate wherein the optical fiber fitted in the groove is secured on the support substrate with a first bonding element constituted by an adhesive injected to fill the groove under the optical fiber; one surface of the support substrate is covered with silicone gel; the support substrate is secured in a package made of plastic; and the package is filled with the silicone gel which is a protective film transparent to light transmitted by the optical fiber and resistant to humidity. |
| 公开日期 | 2002-04-16 |
| 申请日期 | 2001-05-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36756]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | OPNEXT JAPAN, INC. |
| 推荐引用方式 GB/T 7714 | TAKAHASHI, SHOICHI,NAKA, HIROSHI,MIURA, TOSHIMASA,et al. Photoelectronic device and method of manufacturing the same. US6371664. 2002-04-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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