Flexible interconnect structures for electrical devices and light sources incorporating the same
文献类型：专利
| 作者 | BECKER, CHARLES ADRIAN; WEAVER, STANTON EARL; STECHER, THOMAS ELLIOT |
| 发表日期 | 2007-09-25 |
| 专利号 | US7273987 |
| 著作权人 | GENERAL ELECTRIC COMPANY |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Flexible interconnect structures for electrical devices and light sources incorporating the same |
| 英文摘要 | A flexible interconnect structure allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements, such as light-emitting diodes (“LEDs”) and/or laser diodes. The flexible interconnect structure comprises: (1) at least one flexible dielectric film on which circuit traces and, optionally, electrical circuit components are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink attached to one surface of the flexible dielectric film opposite to the surface on which circuit traces are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films, each supporting circuit traces and/or circuit components, and each being attached to another by an electrically insulating layer. Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements attached to the heat sinks so to be in thermal contact therewith. |
| 公开日期 | 2007-09-25 |
| 申请日期 | 2002-03-21 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36855]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | GENERAL ELECTRIC COMPANY |
| 推荐引用方式 GB/T 7714 | BECKER, CHARLES ADRIAN,WEAVER, STANTON EARL,STECHER, THOMAS ELLIOT. Flexible interconnect structures for electrical devices and light sources incorporating the same. US7273987. 2007-09-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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