High speed electronic interconnection using a detachable substrate
文献类型：专利
| 作者 | LEMOFF, BRIAN E.; BUCKMAN, LISA A. |
| 发表日期 | 2005-04-19 |
| 专利号 | US6882044 |
| 著作权人 | AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | High speed electronic interconnection using a detachable substrate |
| 英文摘要 | Conductors to interconnect electronic devices, the conductors being formed on a detachable substrate. The substrate is aligned with a package containing electronic devices. The conductors are bonded to pads on the devices. Then, the substrate is detached. Each conductor is self supporting between the devices, has a two dimensional shape and has a surface that is substantially parallel to a surface of the pads. |
| 公开日期 | 2005-04-19 |
| 申请日期 | 2002-05-17 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36876]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES GENERAL IP PTE. LTD. |
| 推荐引用方式 GB/T 7714 | LEMOFF, BRIAN E.,BUCKMAN, LISA A.. High speed electronic interconnection using a detachable substrate. US6882044. 2005-04-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。