Physically compact device package
文献类型：专利
| 作者 | NG, KEE Y AN; TAN, CHENG WHY; THAM, JI KIN |
| 发表日期 | 2004-10-26 |
| 专利号 | US6809261 |
| 著作权人 | AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Physically compact device package |
| 英文摘要 | A device package has a conductive substrate with at least one mounting site, and an insulating substrate with a first side on the side of the conductive substrate with the one or more mounting sites. The insulating substrate has at least one aperture providing access between a second side of the insulating substrate and the one or more mounting sites. The insulating substrate has one or more signal paths on the second side that couple the one or more apertures to one or more contact sites disposed about the insulating substrate. A series of conductive tabs is coupled to corresponding contact sites. |
| 公开日期 | 2004-10-26 |
| 申请日期 | 2003-06-23 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36985]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. |
| 推荐引用方式 GB/T 7714 | NG, KEE Y AN,TAN, CHENG WHY,THAM, JI KIN. Physically compact device package. US6809261. 2004-10-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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