Protective sealing of optoelectronic modules
文献类型：专利
| 作者 | ITO, MASATAKA; UCHIDA, TOSHI K. |
| 发表日期 | 2008-11-18 |
| 专利号 | US7452140 |
| 著作权人 | IBIDEN CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Protective sealing of optoelectronic modules |
| 英文摘要 | A method and structures for protectively enclosing and sealing optoelectronic modules having emitter or detector diode arrays aligned with optical fiber facets in optoelectronic transmitters and receivers. A non-hermetic enclosure provides mechanical protection of the components during alignment and assembly of the module. A substantially hermetic enclosure provides additional protection of optoelectronic components against airborne contaminants or moisture. The protective enclosures physically encompass the diode array chip with its delicate wire bonds and also provide a liquid containment dam for easier application of resin for protective encapsulation of the diode array chip. Dual resin encapsulation may include a first resin layer chosen for transparency and a harder setting covering layer. These protective variants can be implemented in different combinations offering varying degrees of protection of the optical components. |
| 公开日期 | 2008-11-18 |
| 申请日期 | 2003-07-16 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/36993]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | IBIDEN CO., LTD. |
| 推荐引用方式 GB/T 7714 | ITO, MASATAKA,UCHIDA, TOSHI K.. Protective sealing of optoelectronic modules. US7452140. 2008-11-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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