Circuit package and method of plating the same
文献类型：专利
| 作者 | YAO, XIAOWEI; NGUYEN, TAM; FINOT, MARC; LAKE, RICKIE C.; BENNETT, JEFFREY A.; KOHLER, ROBERT |
| 发表日期 | 2006-03-28 |
| 专利号 | US7019394 |
| 著作权人 | INTEL CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Circuit package and method of plating the same |
| 英文摘要 | A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source. |
| 公开日期 | 2006-03-28 |
| 申请日期 | 2003-09-30 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37010]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEL CORPORATION |
| 推荐引用方式 GB/T 7714 | YAO, XIAOWEI,NGUYEN, TAM,FINOT, MARC,et al. Circuit package and method of plating the same. US7019394. 2006-03-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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