Stack-integrated package of optical transceiver for single core full duplex fiber communications
文献类型：专利
| 作者 | SHIE, JIN SHOWN; HUANG, RONGNAN |
| 发表日期 | 2008-02-19 |
| 专利号 | US7333684 |
| 著作权人 | INTEGRATED CRYSTAL TECHNOLOGY INCORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Stack-integrated package of optical transceiver for single core full duplex fiber communications |
| 英文摘要 | This invention relates to a novel stack-integration package of a light emitter and a photodetector in a high speed, full duplex optical transceiver for fiber communications. The structure is comprised of a photodetector chip, having an isolated micromachined cavity on the chip surface, and a light emitter chip, stacked on the bottom surface inside that cavity, so that a stack-integrated embodiment of light detector and emitter capable of performing full duplex optical communication is resulted. Said cavity surface in the photodetector is coated with reflective metal to prevent direct optical crosstalk from the emitter to the photodetector. Said light emitter means either LED (light emitting diode) or LD (laser diode). The present invention is further characterized by having a transparent encapsulation over the stack-integrated embodiment with a specific surface contour that minimizes the Fresnel reflection at the encapsulation-air interface and its associated crosstalk aftereffect. Such packaging structure is particularly suitable as a component for the purpose of single-core, full-duplex optical fiber communications. |
| 公开日期 | 2008-02-19 |
| 申请日期 | 2004-03-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37053]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTEGRATED CRYSTAL TECHNOLOGY INCORPORATION |
| 推荐引用方式 GB/T 7714 | SHIE, JIN SHOWN,HUANG, RONGNAN. Stack-integrated package of optical transceiver for single core full duplex fiber communications. US7333684. 2008-02-19. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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