Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip
文献类型:专利
作者 | GRUBB, STEPHEN G.; MITCHELL, MATTHEW L.; TAYLOR, ROBERT B.; CHIANG, TING-KUANG; DOMINIC, VINCENT G. |
发表日期 | 2006-03-07 |
专利号 | US7010185 |
著作权人 | INFINERA CORPORATION |
国家 | 美国 |
文献子类 | 授权发明 |
其他题名 | Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip |
英文摘要 | A method of deploying a passive optical combiner that is a broad bandwidth spectral wavelength combiner for combining the outputs from multiples transmitter photonic integrated circuit (TxPIC) chips and, thereafter, the amplification of the combined channel signals with a booster optical amplifier couple between the passive optical combiner and the fiber transmission link. The booster optical amplifier may be a rear earth fiber amplifier, such as an erbium doped fiber amplifier (EDFA), or one or more semiconductor optical amplifiers (SOAs) on one or more semiconductor chips. Such a combination of optical components simplifies the design of individual TxPICs and other such optical communication PICs, which has to take into consideration the nonlinear effects of difficult, high loss single mode fiber (SMF) links or other fiber-type links by allowing a higher power per channel to be achieved compared to the case where channel amplification is attempted directly on the TxPIC chip through the deployment of on-chip optical amplifiers, such as semiconductor optical amplifiers (SOAs), integrated in locations following the electro-optic (EO) modulators, if not integrated also at other locations on the same chip. |
公开日期 | 2006-03-07 |
申请日期 | 2004-07-09 |
状态 | 授权 |
源URL | [http://ir.opt.ac.cn/handle/181661/37088] ![]() |
专题 | 半导体激光器专利数据库 |
作者单位 | INFINERA CORPORATION |
推荐引用方式 GB/T 7714 | GRUBB, STEPHEN G.,MITCHELL, MATTHEW L.,TAYLOR, ROBERT B.,et al. Method of providing a low cost semiconductor transmitter photonic integrated circuit (TxPIC) chip. US7010185. 2006-03-07. |
入库方式: OAI收割
来源:西安光学精密机械研究所
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