System and method for enhanced LED thermal conductivity
文献类型：专利
| 作者 | KEE YEAN NG; SUNDAR A L N YOGANANDAN |
| 发表日期 | 2008-02-20 |
| 专利号 | GB2405529B |
| 著作权人 | INTELLECTUAL DISCOVERY CO., LTD. |
| 国家 | 英国 |
| 文献子类 | 授权发明 |
| 其他题名 | System and method for enhanced LED thermal conductivity |
| 英文摘要 | A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity. |
| 公开日期 | 2008-02-20 |
| 申请日期 | 2004-08-05 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37093]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | INTELLECTUAL DISCOVERY CO., LTD. |
| 推荐引用方式 GB/T 7714 | KEE YEAN NG,SUNDAR A L N YOGANANDAN. System and method for enhanced LED thermal conductivity. GB2405529B. 2008-02-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。