Surface mount type semiconductor device and lead frame structure thereof
文献类型：专利
| 作者 | YOSHIDA, KENICHI |
| 发表日期 | 2007-10-16 |
| 专利号 | US7282785 |
| 著作权人 | STANLEY ELECTRIC CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Surface mount type semiconductor device and lead frame structure thereof |
| 英文摘要 | A surface mount type semiconductor device can be configured to include a pair of lead frames that are butted to each other with a spacing such that ends of the lead frames are opposite to each other. A bare chip can be mounted on a chip mount portion on one end side of one of the lead frames, and wire-bonded to a connection portion on an end side of the other lead frame. A housing can be insert-molded to an end side of both of the lead frames, and the lead frames can be shaped such that they extend along the side and bottom surfaces of the housing and form surface mounting terminal portions. The lead frames are preferably formed to be thin at least at the regions that are to be bent, and other regions thereof are preferably formed to be thick to improve heat radiating effect. |
| 公开日期 | 2007-10-16 |
| 申请日期 | 2004-09-14 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37102]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | STANLEY ELECTRIC CO., LTD. |
| 推荐引用方式 GB/T 7714 | YOSHIDA, KENICHI. Surface mount type semiconductor device and lead frame structure thereof. US7282785. 2007-10-16. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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