Method for producing an optical or electronic module provided with a plastic package
文献类型：专利
| 作者 | AUBURGER, ALBERT; HURT, HANS; PAULUS, STEFAN; SCHUNK, NIKOLAUS; WEBERPALS, FRANK; WITTL, JOSEF |
| 发表日期 | 2008-10-28 |
| 专利号 | US7442559 |
| 著作权人 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method for producing an optical or electronic module provided with a plastic package |
| 英文摘要 | A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed. |
| 公开日期 | 2008-10-28 |
| 申请日期 | 2005-07-27 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37159]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED |
| 推荐引用方式 GB/T 7714 | AUBURGER, ALBERT,HURT, HANS,PAULUS, STEFAN,et al. Method for producing an optical or electronic module provided with a plastic package. US7442559. 2008-10-28. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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