Solder layer and electronic device bonding substrate and submount using the same
文献类型：专利
| 作者 | OSHIKA, YOSHIKAZU; NAKANO, MASAYUKI |
| 发表日期 | 2013-03-26 |
| 专利号 | US8404359 |
| 著作权人 | DOWA ELECTRONICS MATERIALS CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Solder layer and electronic device bonding substrate and submount using the same |
| 英文摘要 | A solder layer and an electronic device bonding substrate using the layer are provided which avoid deteriorating qualities of the electronic device to be bonded. In a solder layer 14 free from lead and formed on a substrate 11 or an electronic device bonding substrate 10 having such a solder layer, the solder layer 14 has a specific resistance of not more than 0.4 Ω·μm. The electronic device bonding substrate 10 can have a thermal resistance of not more than 0.5 K/W and a thickness of not more than 10 μm. Then, voids contained in the solder layer 14 have a maximum diameter of not more than 0.5 μm and the substrate can be a submount substrate. |
| 公开日期 | 2013-03-26 |
| 申请日期 | 2007-03-30 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/37309]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DOWA ELECTRONICS MATERIALS CO., LTD. |
| 推荐引用方式 GB/T 7714 | OSHIKA, YOSHIKAZU,NAKANO, MASAYUKI. Solder layer and electronic device bonding substrate and submount using the same. US8404359. 2013-03-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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